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datashee t product structure silicon monolithic integrated circuit this product has no designed protec tion against radioactive rays . 1/14 tsz02201-0r7r0g300030-1-2 ? 2014 rohm co., ltd. all rights reserved. 31.jan.2014.rev.004 tsz22111 ? 14? 001 www.rohm.com voltage detector ic series cmos over voltage detector ic bd71l4l-1series general descriptions rohm?s bd71l4l-1series is highly accurate and low current over voltage detector ic. it is an n-channel open-drain output type with det ection voltage of 4.05v and hysteresis voltage of 30mv. it is most suitable for monitoring the charge of a lithium-ion battery. features ? high accuracy detection voltage ? low current consumption ? n-channel open drain output ? wide operating temperature range ? very small and low height package ? package ssop5 is similar to sot-23-5 (jedec) typical application circuit key specifications ? detection voltage: 4.05v (typ.) ? high accuracy detection voltage: 0.8% ? ultra-low current consumption: 0.8 a (typ.) ? operating temperature range: -40c to +85c package ? ssop5: 2.90mm x 2.80mm x 1.25mm ? hvsof5: 1.60mm x 1.60mm x 0.60mm applications ? all electronics equipment with lithium-ion battery ? all electronics equipment that needs over-voltage protection v dd1 bd71l4l-1 v dd2 gnd micro controller r st c l ( capacitor fo r noise filtering r l c in
datasheet datasheet 2/14 bd71l4l-1series tsz02201-0r7r0g300030-1-2 ? 2014 rohm co., ltd. all rights reserved. 31.jan.2014.rev.004 www.rohm.com tsz22111 ? 15? 001 part function output logic detection voltage value package packaging and number 71 : over voltage l : active 4l : 4.05v g : ssop5 forming spe cification detector low hfv : hvsof5 embossed tape and reel tr : the pin number 1 is the upper right : ssop5 : hvsof5 r t xxxx-1 bdx x connection diagram ssop5 hvsof5 pin descriptions ssop5 hvsof5 pin no. symbol function pin no. symbol function 1 out reset output 1 out reset output 2 vdd power supply voltage 2 sub * substrate 3 gnd gnd 3 vdd * power supply voltage 4 n.c. unconnected terminal 4 vdd * power supply voltage 5 n.c. unconnected terminal 5 gnd gnd * the sub pin(2pin) and the vdd pins(3pin, 4pin) must be wired together. ordering information lot. no top view out vdd gnd n.c. n.c. marking top view out sub vdd gnd vdd 4 3 2 1 5 marking lot. no
datasheet datasheet 3/14 bd71l4l-1series tsz02201-0r7r0g300030-1-2 ? 2014 rohm co., ltd. all rights reserved. 31.jan.2014.rev.004 www.rohm.com tsz22111 ? 15? 001 absolute maximum ratings parameter symbol limits unit power supply voltage v dd -gnd -0.3 to +7 v output voltage n-channel open drain output v out gnd-0.3 to +7 v output current io 70 ma power dissipation ssop5 *1*3 pd 0.540 w hvsof5 *2*3 0.530 operating temperature topr -40 to +85 c ambient storage temperature tstg -55 to +125 c *1 reduced by 0.0054w/c when used over 25c. *2 reduced by 0.0053w/c when used over 25c. *3 when mounted on rohm standard circuit board (70mm70mm1.6mm, glass epoxy board). caution: operating the ic over the absolute maximum ratings may damage t he ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. electrical characteristics (unless otherwise specified, ta=0c to 60c, v dd =1.2v to 6.0v) parameter symbol conditions limit unit min typ max detection voltage v det r l =470k ? v dd =l h ta = 2 5 c 4.034 4.05 4.066 v ta =0c to 60c 4.018 - 4.083 hysteresis voltage v det v dd =l h l, r l =470k ? - 30 40 mv output delay time ?l h? t plh r =100k ?, c l =100pf *4 vout gnd 50% - - 100 s output delay time ?h l? t phl r =100k ?, c l =100pf *5 vout v dd 50% - - 100 s supply current 1 i dd1 v dd = v det + 0.2v - 0.60 2.40 a supply current 2 i dd2 v dd = v det - 0.2v - 0.70 2.80 a operating voltage range v opl v out 0.8v, r l =470k ? 1.20 - - v ?low? output voltage(nch) v ol v dd = v det +0.2 v, i sink =4.0ma - - 0.3 v output leak current i leak v dd =v ds =3.8v - - 1.0 ua v det standard detection voltage 4.05v r pull-up resistor between vout and vdd. c capacitor to be connected between v out and gnd. designed guarantee.(outgoing inspection is not done on all products.) *4 t plh v dd v det typ. + 0.5v to v det typ.- 0.5v *5 t phl v dd v det typ - 0.5v to v det typ.+ 0.5v block diagram figure 1. bd71l4l-1 vout gnd vdd vref
datasheet datasheet 4/14 bd71l4l-1series tsz02201-0r7r0g300030-1-2 ? 2014 rohm co., ltd. all rights reserved. 31.jan.2014.rev.004 www.rohm.com tsz22111 ? 15? 001 0 10 20 30 40 50 60 70 80 90 100 110 0 5 10 15 20 low output voltage : v ol [m v] is ink[m a] 0.0 0.2 0.4 0.6 0.8 1.0 0.20.30.40.50.60.70.8 operating voltage range :v opl [v] supply voltage:v dd [v] 0.0 1.0 2.0 3.0 4.0 5.0 01234567 detection voltage : v det [v] supply voltage : v dd [v] 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 01234567 circuit current : i dd (a) supply voltage : v dd [v] typical performance curves BD71L4LG-1 figure 2. detection voltage bd71l4l-1 figure 3. circuit current bd71l4l-1 figure 4. low output voltage v dd =4.0v bd71l4l-1 figure 5. operating voltage range ta=25c ta = 0 c ta=60c ta=25c ta = 0 c ta=60c bd71l4l-1 ta=25c ta = 0 c ta=60c ta=25c ta = 0 c ta=60c
datasheet datasheet 5/14 bd71l4l-1series tsz02201-0r7r0g300030-1-2 ? 2014 rohm co., ltd. all rights reserved. 31.jan.2014.rev.004 www.rohm.com tsz22111 ? 15? 001 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0 102030405060 circuit current when off : i dd [a] temperature : ta[ c] 3.80 3.85 3.90 3.95 4.00 4.05 4.10 4.15 4.20 0 102030405060 detection voltage : v det [v] temperature : ta[ c] 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0 102030405060 operating voltage range : v opl [v] temperature : ta[ c] 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0 102030405060 circuit current when on : i dd [a] temperature : ta[ c] typical performance curves ? continued 3.0 bd71l4l-1 bd71l4l-1 figure 8. supply current 1 vs. temperature v dd =v det -0.2v v dd = 3.85v high to low(vdet) low to high (vdet- vdet) bd71l4l-1 figure 6. detection voltage vs. temperature bd71l4l-1 figure 7. operating volta ge range vs. temperature figure 9. supply current 2 vs. temperature v dd =v det +0.2v v dd =4.25v
datasheet datasheet 6/14 bd71l4l-1series tsz02201-0r7r0g300030-1-2 ? 2014 rohm co., ltd. all rights reserved. 31.jan.2014.rev.004 www.rohm.com tsz22111 ? 15? 001 0 10 20 30 40 50 60 70 80 90 100 0.8 1.2 1.6 2 2.4 2.8 puls e wiidth hign : wd[s ] v dd-low : v dd [v] 12 16 20 24 28 32 36 40 0 102030405060 output delay tim e : t phl [s ] temperature : ta[ c] 10 11 12 13 14 15 16 17 18 19 20 0 102030405060 ooutput delay time : t plh [s ] temperature : ta[ c] 0 10 20 30 40 50 60 70 80 90 100 0 102030405060 pulse width high : wd[s] temperature : ta[ c] typical performance curves ? continued bd71l4l-1 bd71l4l-1 bd71l4l-1 figure 10. output delay time (t phl ) v dd =v det -0.5v to v det +0.5v v dd =3.55v to 4.55v figure 11. output delay time(t plh ) v dd =v det +0.5v to v det -0.5v v dd =4.55v to 3.55v figure 12. pulse width vs. voltage level v dd-low =1.2v, v dd-high =4.2v, c in =0.1uf output will not change when pulse width is lower or equal to these results. pulse width above the results will cause the output to change. bd71l4l-1 figure 13. pulse width vs. voltage level v dd-high =4.2v, c in =0.1uf, ta=25c output will not change when pulse width is lower or equal to these results. pulse width above the results will cause the output to change.
datasheet datasheet 7/14 bd71l4l-1series tsz02201-0r7r0g300030-1-2 ? 2014 rohm co., ltd. all rights reserved. 31.jan.2014.rev.004 www.rohm.com tsz22111 ? 15? 001 application information explanation of operation the detection and release voltages are used as threshold voltages . when the voltage applied to the vdd pins reaches the appropriate threshold voltage, the out terminal voltage switches fr om either ?high? to ?low? or from ?low? to ?high?. please refer to the timing waveform and electrical c haracteristics for information on hysteresis. because the bd71l4l-1 uses an open drain out put type, it is necessary to connect a pull-up resistor to vdd or another power supply if needed [the output ?high? voltage (v out ) in this case becomes v dd or the voltage of the other power supply]. figure 14. internal block diagram timing waveform example: the following shows the relationship between the input voltages (v dd ) and the output voltage (v out ) when the input power supply voltage (v dd ) swept up and down (the circuits are those in figure .14). 1 when the power supply is tur ned on, the output is unstable from after over the oper ating limit voltage (v opl ) until t plh . therefore it is possible that the reset signal is not outputted when the rise time of v dd is faster than t plh . 2 when v dd is greater than v opl but less than the reset detection voltage (v det ), the output voltages will switch to high. 3 if v dd exceeds the reset detection voltage (v det ), then v out switches from h to l. 4 if v dd drops below the release voltage (v det + ? v det ) when the power supply is powered down or when there is a power supply fluctuation, v out switches to h (with a delay of t plh ). 5 the potential difference between the detection voltage and the release voltage is known as the hysteresis width ( ? v det ). figure 15. timing waveform vre f r1 r2 vdd gnd q1 vout r3 r l v dd v det v opl 0v v out t phl t phl t plh v ol v oh v det - v det t plh
datasheet datasheet 8/14 bd71l4l-1series tsz02201-0r7r0g300030-1-2 ? 2014 rohm co., ltd. all rights reserved. 31.jan.2014.rev.004 www.rohm.com tsz22111 ? 15? 001 circuit applications 1) examples of a common power supply detection reset circuit. case1: power supply of the microcontroller (v dd2 ) differs from the power supply of the reset detection ic (v dd1 ). use an open drain output type device with a load resistance r l attached as shown in figure 16. case2: power supply of the microcontroller (v dd1 ) is same as the power supply of the reset detection ic (v dd1 ). use an open drain device with a pull up resistor between output and vdd1. this ic?s hysteresis between detection voltage and release voltage is 30mv(typ), so when the vout logic changes a chattering occur. c in value needs more than 0.1uf to eliminate this. when a capacitance c l for noise filtering is connected to the out pin (the reset signal input terminal of the microcontroller), please take into account the rise and fall waveform of the output voltage (v out ). the electrical characteristics were measured using r l = 470k ? and c l = 100pf. 2) the following is an example of a circuit application in which an or connection between two types of detection voltage resets the microcontroller. to reset the microcontroller when many independent power supplies are used in the system, or connect to the microcontroller?s input with pull-up resistor to the supply voltage of the microcontroller (v dd3 ) as shown in figure 17. by pulling-up to vdd3, output ?high? voltage of micro-controller power supply is possible. v dd1 bd71l4l-1 v dd2 gnd micro controlle r r st c l ( capacitor is fo r noise filtering r l c in figure 16. open drain output type v dd2 v dd1 v dd3 gnd microcontroller r l bd71l4l-1 bd71l4l-1 r st figure 17
datasheet datasheet 9/14 bd71l4l-1series tsz02201-0r7r0g300030-1-2 ? 2014 rohm co., ltd. all rights reserved. 31.jan.2014.rev.004 www.rohm.com tsz22111 ? 15? 001 3) examples of the power supply with resistor dividers in applications wherein the power supply voltage of an ic co mes from a resistor divider circuit, an in-rush current will flow into the circuit when the output level switches from ?high? to ?low? or vice versa. in-rush current is a sudden surge of current that flows from the power supply (vdd) to ground (gnd) as the output logic changes its state. this current flow may cause malfunction in the systems oper ation such as output oscillations, etc. figure 18 when an in-rush current (i1) flows into the circuit (refer to figure 18.) at the time when output switches from ?low? to ?high?, a voltage drop of i1r2 (input resistor) will occur in the circuit causing the vdd supply voltage to decrease. when the vdd voltage drops below the detection voltage, the out put will switch from ?high? to ?low?. while the output voltage is at ?low? condition, in-rush current will stop flow ing and the voltage drop will be reduced. as a result, the output voltage will switches again from ?low? to ?high? which causes an in-rush current and a voltage drop. this operation repeats and will result to oscillation. it is same when only the r2 used. v out r2 v dd bd71l4l-1 gnd r1 i1 v1 cin c l i dd v dd v det 0 in-rush current figure 19. current consumption vs. power supply voltage
datasheet datasheet 10/14 bd71l4l-1series tsz02201-0r7r0g300030-1-2 ? 2014 rohm co., ltd. all rights reserved. 31.jan.2014.rev.004 www.rohm.com tsz22111 ? 15? 001 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ic?s power supply terminals. 2. power supply lines design the pcb layout pattern to provide low impedanc e ground and supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in t he ground and supply lines of the digital block from affecting the analog block. furthermore, connect a capacitor to gr ound at all power supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large- current gnd traces, the two ground trac es should be routed separately but connected to a single ground at the refe rence point of the application board to av oid fluctuations in the small-signal ground caused by large currents. also ens ure that the gnd traces of external components do not cause variations on the gnd voltage. the power supply and ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceeded, the rise in temperature of the chip may result in deterioration of the properties of the ch ip. the absolute maximum rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expect ed characteristics of the ic can be approximately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. 7. rush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling capacitance, power wiring, width of gnd wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a ca pacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ic?s power supply should always be turned off completely before connecting or removi ng it from the test setup duri ng the inspection process. to prevent damage from static discharge, ground the ic durin g assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mount ing the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground. inter-pin shorts could be due to many reasons such as metal particles, water droplets (i n very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. unused input terminals input terminals of an ic are often connected to the gate of a mo s transistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electr ic field from the outside can easily charge it. the small charge acquired in this way is enough to produce a signifi cant effect on the conducti on through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused i nput terminals should be connected to the power supply or ground line. 1 2. regarding input pins of the ic in the construction of this ic, p-n junctions are inevitably formed creating parasitic diodes or transistors. the operation of these parasitic elements can result in mutual interferen ce among circuits, operational faults, or physical damage. therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower than the gnd voltage should be avoided. furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the ic. even if the power supply voltage is applied, make sure t hat the input terminals have voltages within the values specified in th e electrical characteristics of this ic
datasheet datasheet 11/14 bd71l4l-1series tsz02201-0r7r0g300030-1-2 ? 2014 rohm co., ltd. all rights reserved. 31.jan.2014.rev.004 www.rohm.com tsz22111 ? 15? 001 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 14. bypass capacitor for noise rejection to help reject noise, put a 1f capacitor between vdd pin and gnd and 1000pf capacitor between vout pin and gnd. be careful when using extremely big capa citor as transient response will be affected. 15. the vdd line impedance might cause oscillat ion because of the detection current. 16. a vdd to gnd capacitor (as close connection as possible) should be used in high vdd line impedance condition. 17. lower than the mininum input voltage puts the v out in high impedance state, and it must be v dd in pull up (v dd ) condition. 18. external parameters the recommended parameter range for r l is 10k ? to 1m ? . there are many factors (board layout, etc) that can affect characteristics. please verify and co nfirm using practical applications. 19. power-on reset operation please note that the power on reset output varies with the v dd rise time. please verify the behavior in the actual operation. 20. this ic has extremely high impedance terminals. small l eak current due to the uncl eanness of pcb surface might cause unexpected operations. application values in these conditions should be selected carefully. if the leakage is assumed between the vout terminal and the gnd terminal, t he pull up resistor should be less than 1/10 of the assumed leak resistance.
datasheet datasheet 12/14 bd71l4l-1series tsz02201-0r7r0g300030-1-2 ? 2014 rohm co., ltd. all rights reserved. 31.jan.2014.rev.004 www.rohm.com tsz22111 ? 15? 001 physical dimension, tape and reel information package name ssop5
datasheet datasheet 13/14 bd71l4l-1series tsz02201-0r7r0g300030-1-2 ? 2014 rohm co., ltd. all rights reserved. 31.jan.2014.rev.004 www.rohm.com tsz22111 ? 15? 001 package name hvsof5 direction of feed reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper right when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs tr () 1pin
datasheet datasheet 14/14 bd71l4l-1series tsz02201-0r7r0g300030-1-2 ? 2014 rohm co., ltd. all rights reserved. 31.jan.2014.rev.004 www.rohm.com tsz22111 ? 15? 001 revision history date revision changes 20.may.2013 001 new release 24.july.2013 002 modify the general description and applications on page 1 changed vdet spec on pages 1 ~ 3 changed idd1 and idd2 spec on page 3 changed i leak condition on page 3 24.oct.2013 003 add 1 packages as following:hvsof5 31.jan.2014 004 modify the package on page 1 and the connection diagram on page 2 add note of hvsof5 on page 2
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, ro hm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified bel ow), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range descr ibed in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.

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